Specification:

1. Adhesive force: 3.5 kg/inch
2. Holding force:  >60 hrs/inch2   100ºC
3. Weight lose：<1 @204ºC/24 Hr
4. Specific gravity：1.85±0.1 g/cm3
5. Hardness：15-25 ASTM D2240
6. Withstand voltage：>2.5 KV/mm
7. Fire resistance:V-0  UL-94
8. Volume resistivity: 1.2*10 1 Ω.CM ASTM D257
9. Temperature scope:-20～+180ºC  EN 344
10. Heat conductivity：1.2   W/M.K

Performance:

1.Special for adhesion the heat sink and chip(CPU & IC & LED). Also usually used in the Aluminium base board, SUS, PS, ABS, PP , PC etc.

2. Highly heat-conductive and stickiness, improve the product life, it is the first choice for high-end

electronic products.

3. Stable performance and long life, it can work at least 5 years under the normal temperature.

4.Environmental protection. In accordance with SGS / ROHS standard.

Mainly customers: LCD, LED, CPU, IC BGA etc electronic industry and Household electric appliance Plant.

If any question, please feel free to let us know. Thanks!